| Dividend Yield | 4.15% |
| P/B Ratio | 2 |
| Aggregate Leverage Ratio | 39.7 |
| Occupancy Rate | 97.6% |
| WALE | 4.4 year(s) |
| Interest Coverage Ratio | 5.1 times |
| Fixed Rate Debt | 71% |
| Ex-dividend Date | 2 Aug 2024 |
| Record Date | 5 Aug 2024 |
| Payout Date | 23 Sep 2024 |
| Type | Data Center |
Remarks
The price-to-book P/B ratio of >1.6x indicates a premium to fair value, partially due to the perceived stability of the data center sector.
David Ang - 19 Oct 2024Keppel DC REIT's debt profile weakened slightly in Q3 2024, with the aggregate leverage ratio increasing to 39.7%. However, the overall debt profile is still relatively healthy.
David Ang - 19 Oct 2024Keppel DC REIT has no refinancing obligation due in 2024 and only 6.3% in 2025. These low refinancing obligations should allow the REIT to weather the higher interest rate environment, which may last throughout 2024 and 2025.
David Ang - 19 Oct 2024Keppel DC REIT reported a healthy 6.1% YoY increase in DPU in 3Q 2024. Higher revenue was mainly due to strong rental reversions and a contribution from Tokyo DC 1.
David Ang - 19 Oct 2024Geographical Exposure
| Singapore | 53.1% |
| Ireland | 7.8% |
| Australia | 7.2% |
| China | 7% |
| Netherlands | 6.6% |
| Germany | 6.3% |
| Japan | 5.4% |
| United Kingdom | 4.6% |
| Italy | 1.5% |
| Malaysia | 0.5% |
Sectoral Exposure
| Data Center | 100% |
Dividend Distribution History (DPU)
Debt Maturity Profile
In $ millions
Show debt maturity profile details
| Fiscal Year | Debt (in $ millions) | Percentage |
|---|---|---|
| FY24 | 0 | 0% |
| FY25 | 101 | 6.3% |
| FY26 | 296 | 18.5% |
| FY27 | 638 | 39.9% |
| FY28 | 262 | 16.4% |
| FY29 | 19 | 1.2% |
| FY30 | 72 | 4.5% |
| FY31 | 211 | 13.2% |
Disclaimer: We do not guarantee the data above is accurate. The information presented here is for general information only. It is not intended to be and does not constitute financial advice, investment advice, trading advice, or any other advice or recommendation of any sort. Please do your own research before investing.